Description: The Electronic Visions system is comprised of the precision optical 620 Aligner (described here) and the 501 Wafer Bonder (for description, click <here>). With the standard mask frame insert, the 620 Aligner module can perform precision mask-to-wafer front- or back-side alignment for near-UV photoresist exposure in any one of four modes (proximity, hard- and soft- contact, and vacuum contact.) With a specially provided bond tool, the 620 Aligner can perform proximity alignment of two wafers for processing in the 501 Bonder. Our current configuration accomodates 4" wafers and 5" masks.

Features:
• Interchangeable mask frame and bond tools permit alignment of mask-to-wafer or wafer-to-wafer.
• Frontside mask-to-wafer alignment accuracy to <0.6 microns.
• Precision front-to-backside alignment to < 1 micron.
• Four different mask exposure modes: proximity, soft- and hard- contact, and vacuum contact.
• Fully motorized, split field microscopes with multiple objectives for wafer top and bottom side viewing.
• Backside alignment modes: optical image capture, user-specified cross-hairs, or customized alignment keys.
• Near UV (350 - 450 nm) lamp source.

(Please note that there is a two-hour reservation limit on this tool during prime time.)