Karl Suss MA-6 Contact Mask Aligner: karlsuss

Description: The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer front- or back-side alignment and near-UV photoresist exposure in any one of three modes (hard- and soft- contact, and high and low vacuum contact; proximity is also possible, although we currently lack the tooling.) Our current configuration accomodates 3" and 4" wafers and pieces. SNF has two MA-6 aligners (Coral names: karlsuss and karlsuss2.)

Features:

  • Contact 1:1 aligner.
  • DUV and IR capability (karlsuss)
  • Two mask holder sizes are available, 4" and 5".
  • Wafer size is 4", 3" and pieces.
  • Maximum wafer thickness 4.3mm
  • Split field microscope for top-side and bottom-side viewing.
  • Split-field objective separation distances from 50mm to 100mm.
  • Best resolution = .75um or better in vacuum contact mode

(Please note that there is a two-hour reservation limit on this tool during prime time.)

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Stanford Nanofabrication Facility
Last Modified 07/06/2006