The following programs should NOT be changed!

STANDARD DEVELOP PROGRAMS TRACKS 1 (back) & 2 (front)

NEW:

STATION: DEVELOP PROGRAM #2: Shipley SPR 955 CM-.7 Resist 0.7 µm and 1.0µm
(dispenser 1 MF-26A surfactant)

Event Operation Time Speed Accel
1 SPIN 01.0 5.00 20
2 SPRAY1 02.0 1.00 20
3 STREAM1 03.0 0.08 20
4 SPIN 22.0 0.00 20
5 RINSE 5.0 0.80 20
6 STREAM1 01.0 0.08 20
7 SPIN 22.0 0.00 20
8 RINSE 15.0 0.80 20
9 SPIN 20.0 5.00 20

Following 3 steps are necessary for the development of the I Line resist Shipley SPR 955 CM-.7:

1.step: Bake Prog#3 for PEB (Post Exposure Bake) 90 seconds

2.step: Develop Prog#2 or Prog#5

3.step: Bake Prog#1 for hardbake 60 seconds

 

STATION: DEVELOP PROGRAM #5: Shipley SPR 955 CM-.7 Resist 0.7 µm and 1.0µm
(dispenser 1 MF-26A surfactant)

Event Operation Time Speed Accel
1 SPIN 01.0 5.00 20
2 SPRAY1 02.0 1.00 20
3 STREAM1 03.0 0.08 20
4 SPIN 22.0 0.00 20
5 SPRY1 5.0 0.80 20
6 STREAM1 01.0 0.08 20
7 SPIN 22.0 0.00 20
8 RINSE 15.0 0.80 20
9 SPIN 20.0 5.00 20

Following 3 steps are necessary for the development of the I Line resist Shipley SPR 955 CM-.7:

1.step: Bake Prog#3 for PEB (Post Exposure Bake) 90 seconds

2.step: Develop Prog#2 or Prog#5

3.step: Bake Prog#1 for hardbake 60 seconds

 

 

STATION: DEVELOP PROGRAM #3: 3612 RESIST 1.0µm (dispenser 2 LDD26W)

Event

Operation

Time

Speed

Accel

1

SPIN

01.0

5.00

20

2

SPRAY2

02.0

1.00

20

3

STREAM2

03.0

0.08

20

4

SPIN

30.0

0.00

20

5

RINSE

10.0

0.80

20

6

STREAM2

03.0

0.08

20

7

SPIN

30.0

0.00

20

8

RINSE

15.0

0.80

20

9

SPIN

20.0

5.00

20

STATION: DEVELOP PROGRAM #4 3612 RESIST 1.6µm (dispenser 2 LDD26W)

Event

Operation

Time

Speed

Accel

1

SPIN

01.0

5.00

20

2

SPRAY2

02.0

1.00

20

3

STREAM2

03.0

0.08

20

4

SPIN

60.0

0.00

20

5

RINSE

10.0

0.80

20

6

STREAM2

03.0

0.08

20

7

SPIN

60.0

0.00

20

8

RINSE

15.0

0.80

20

9

SPIN

20.0

5.00

20

 

STATION: DEVELOP PROGRAM #6 SPR220-7 RESIST 7µm (dispenser 2 LDD26W)

Event

Operation

Time

Speed

Accel

1

STREAM2

10.0

0.08

20

2

SPIN

99.9

0.00

20

3

STREAM2

10.0

0.08

20

4

SPIN

99.9

0.00

20

5

STREAM2

10.0

0.08

20

6

SPIN

99.9

0.00

20

7

SPRAY2

15.0

0.80

20

8

RINSE

20.0

0.80

20

9

SPIN

20.0

5.00

50

 

STATION: DEVELOP PROGRAM #7 SPR220-3 RESIST 3 - 4 µm (dispenser 2 LDD26W)

Event

Operation

Time

Speed

Accel

1

STREAM2

10.0

0.08

20

2

SPIN

70.0

0.00

20

3

STREAM2

10.0

0.08

20

4

SPIN

99.9

0.00

20

5

STREAM2

10.0

0.08

20

6

SPIN

70.0

0.00

20

7

SPRAY2

15.0

0.80

20

8

RINSE

20.0

0.80

20

9

SPIN

20.0

5.00

50

 

 

STANDARD BAKE PROGRAMS TRACK 1 and 2

STATION: BAKE PROGRAM #1 ( for coat Program#7 3612 1.0 µm) TEMP 110°C

Event

Operation

Time

1

BAKE

60.0

2

END

0

STATION: BAKE PROGRAM #2 ( for coat Program #8 3612 1.6 µm) TEMP 110°C

Event

Operation

Time

1

BAKE

120.0

2

END

0


STATION: BAKE PROGRAM #3
( for coat Program #5 SPR 955 CM-.7 0.7 or 1 µm) TEMP 110°C

Event

Operation

Time

1

BAKE

90.0

2

END

0


Comment:

For SPR220-3 and SPR220-7 resists is no bake after development required!


Bake programs can be used for PEB (Post Exposure Bake):

Bake Prog #1 for 1µm SPR3612 resist

Bake Prog #2 for 1.6µm SPR3612 resist

Bake Prog #3 for 0.7 or 1 µm SPR 955 CM-.7 resist

 



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Stanford Nanofabrication Facility
webmaster@snf.stanford.edu
Last Modified 03/20/2008