The wbdiff wet bench is in the Clean Equipment Group. Wafers that have been processed in equipment outside of this equipment group may not be processed at wbdiff, with the exceptions as listed below. Materials control policies are governed by equipment groups; for the description of this policy, click <here>. For equipment compatibility with specific materials, click <here>.

Special cases:

• Wafers which have been previously etched in KOH must undergo decontamination procedures at wbsilicide.
• Wafers that have just been scribed must undergo piranha clean at wbnonmetal before being processed at wbdiff.
• Wafers with resist must be stripped of resist using the piranha clean at wbnonmetal prior to processing here.
• Wafers that have been in contact with analytical tools in the semiclean equipment group must undergo the 5:1:1 H2O:HCl:H2O2 clean at wbsilicide prior to processing here. Fresh chemicals must be used at wbsilicide and aspirated after use (they are regarded as potentially contaminated.)

This wet bench is used before every critical furnace or deposition process. Therefore, perhaps more than any other station in the lab, it is absolutely imperative that procedures for proper handling and processing of materials be scrupulously observed, in order to minimize risk of contamination and thus minimize the potential for adversely affecting the research of other labmembers who use this equipment.

We ask that wbdiff users to be very careful about their processing. We also recognize that occasional mistakes can happen, particularly in this dynamic research environment -- we only ask that wbdiff users quickly report mistakes or accidents, so that staff can respond quickly to minimize any problem.