Acceptable Materials
General Use Wet Bench: wbgeneral

The wbgeneral appears in all three equipment groups (clean, semiclean, and gold) as part of the general-purpose wet benches tool set. Processing may require dedicated labware.

Materials control policies are governed by equipment groups; for the description of this policy, click <here>. For equipment compatibility with specific materials, click <here>.

Substrate Contamination Control:

Since wafer processing is done manually in glassware (or more appropriately, "labware") the Equipment Group (clean, semiclean, or gold) is really determined by the cleanliness of the labware. Labware at the wbgeneral station is considered Gold Contaminated. In order for wafers processed at wbgeneral to be allowed into Clean or Semiclean Equipment, the labware used must be fused silica or "quartz" (which does not contain sodium normally found in normal lab glassware.) For Clean equipment, the labware must never have been in contact with solutions or materials containing alkali (Na, K, Li) or any metals. For Semiclean equipment, labware must never come into contact with alkali nor any non-standard metals (standard metals are acceptable.) Labmembers must obtain their own Clean or Semiclean labware, and must label and store it to prevent possible contamination through general use.

Acceptable Processing:

Wbgeneral is designed for handling of general acids and bases. Consult the Materials List for the etchants which are acceptable for use here. No solvents may be used at wbgeneral. Follow appropriate lab safety and chemical handling guidelines.

Other guidelines for wbgeneral:

1) Hypophosphoric Acid/Iodine etch (Indium Tin oxide etchant) is allowed at the WBGENERAL ONLY.

2) Transine Gold Etch is allowed on a case by case APPROVAL and may only be used at wbgeneral. See SpecMat for approval.

3) NONMETAL WAFERS that have had KOH etch in a nonmetal contaminated beaker and then are cleaned up in a CLEAN DESIGNATED QUARTZ beaker (CASE BY CASE APPROVAL REQUIRED) may return to CLEAN equipment. For procedures, click <here>.

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Last Modified 08/29/2003

 

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