Important Notes:

1. Clean should be done in your own non-standard metal designated beakers or the gold contaminated beakers found at the wbgeneral. ONCE the wafers have been cleaned in contaminated beakers or been in nonstandard metal contaminated equipment they can only go in equipment that allows the materials they have been exposed to ( see Materials Allowed).
2. If wafers have been scribed or have resist on them they should get the Resist Strip Non-standard Metal process at the wbgeneral before going into the Non-standard Metal Clean.

PROCESS

• 5 minutes in PRS1000 @ 40 C
• Dump Rinse (std 6 cycles) OR overflow rinse for 5 minutes.
• Blow Dry the wafers on clean room lint free papers using a N₂ gun.
• Dump Rinse (std 6 cycles) OR overflow rinse for 5 minutes.
• Blow Dry the wafers on clean room lint free papers using a N₂ gun