Operating Instructions
General-use Wet Bench: wbgeneral
  1. System Overview
    1.1 Process
    1.2 Substrates
    1.3 Materials Allowed
    1.4 Facilities
    1.5 Equipment Description
  2. Safety
    2.1 Chemical Hazards
    2.2 Equipment Hazards
    2.3 Process Hazards
    2.4 Interlocks
    2.5 Alarms
  3. Qualification Checklist
  4. Operation
    4.1 Preparation
    4.1.1 Gloves
    4.1.2 Cassettes and other Labware
     4.2 Equipment Setup
    4.3 Startup
    4.4 Test Run
    4.5 Processing
    4.5.1 Labeling Containers
    4.5.2 Pouring Chemicals
    4.5.3 Chemical Handling
    4.5.4 Etching Substrates
    4.5.5 Disposing of Used Chemicals
    4.6 Standby
  5. Routine Maintenance and Calibration
    5.1 Daily
    5.2 Weekly
    5.3 Monthly
    5.4 Other: Changing Acids
  6. Shutdowns
    6.1 Standby
    6.2 Emergency
  7. Troubleshooting
  8. Equipment Backup
  9. Additional Process Info
    9.1 90% Sulfuric/Peroxide Photoresist Strip
    9.2 4:1 Sulfuric:Peroxide Piranha Clean
    9.3 HF-based Etchants
    9.3.1 50:1 HF and 49% HF
    9.3.2 BOE Etchants
    9.4 KOH

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Stanford Nanofabrication Facility
Last Modified 07/11/2006