Important Notes:

1. Once you use wbsilicide you are considered contaminated with Al, Ti and W. You may not go into nonmetal restricted equipment. You may only go into furnaces that allow these standard metals (ie tylanfga, tylanbpsg metal side ONLY, tylan7).
2. Make sure wafers have never had GaAs or non-standard metals on them or been in beakers or equipment that is contaminated with non-standard metals.
3. Only silicides of "standard metals" (Al, Ti, W) can be on them.
4. Wafers that have had "standard metals" on them and then it was stripped off can also be cleaned at the wbsilicide. DO NOT use this clean bench to strip the metals!
5. If wafers have been scribed or have resist on them they should go into the resist strip bath (@wbsilicide) before going into the standard clean baths (@wbsilicide).

PROCESS

• 10 minutes in H₂SO₄:H₂O₂ (4:1) @ 90 C
• Dump Rinse (std 6 cycles)
• 15 seconds in HF (50:1) @ room temp
• Dump Rinse (std 6 cycles)
• 10 minutes in H₂O:HCl:H₂O₂ (5:1:1) @ 70 C
• Dump Rinse (std 6 cycles)
• Spin Dry (Auto; Rinse 120 sec; Dry 280 sec; Resistivity >16 M ohm-cm)

Note: Wafers must be loaded into furnaces within 1 hour after clean -- or re-clean them.