Next Meeting: Friday, March 21, 11:30-1 in CIS 101.

3/7 Meeting summary:

First, there was a brief overview of maskmaking resources outside SNF. This information will be posted on an internal Stanford server shortly. In the second part of the meeting, each of the functional area organizers in attendance presented a proposals for data collection on Coral, based on the scheme that three types of processing are done: Process Qual, Standard Process, Custom/User Process. There was general agreement that the data people would like to see are: trends from process quals; raw data and comments from individual users. There was also agreement from the previous meeting that there should be a "comments" field to encourage people to add their observations about equipment performance.

Metals - J.

Qual Procedure: Apply tape or dots to a wafer. Deposit metals. Measure thickness on profilometer, measure sheet rho, monitor crystal thickness as applicable. For innotec and metalica, measure Al. For gryphon, rotate through Al/ AlSi, Ti.

metalica:
Base pressure, power, deposition pressure, metal(s) used, target thickness, crystal thickness (all processing)
Thickness (T,C,B,L.,R), sheet rho (Process Qual only)

innotec:
Power, deposition time, metal(s) used, crystal thickness (all processing)
Thickness (T,C,B,L.,R), sheet rho (Process Qual only)

gryphon:
Power, pressure during dep, pump pressure, base pressure, metal(s) used, dep time (all processing)
Thickness (T,C,B,L.,R), sheet rho (Process Qual only)

epi - Renata

Qual procedure: 1 micron, n-doped, single crystal Si deposited on p-doped silicon wafer.

Recipe: type, name, description (all processing)

Machine checks: base pressure, leak pressure (all processing)

Inputs (setpoint and actual): Bake Temp, Bake H2 flow, Dep temp, dep H2 flow, dep silane flow, dep N-inj, dep N-source, dep N-dil, dep time (all processing)

Outputs: dep rate, film quality (all processing) and resistivity (qual, optional for standard & custom/user)

Other: Did you etch the chamber? Which recipe? How many times? DId you receive an error (describe)? And general comments.

RTA's - Raja

Qual Procedure: Dep rate and uniformity for oxidation on silicon at 1150 C and 950 C. Measure on Woollam. Silicide growth as a possible indicator for leaks.

Data collected: TCBLR thickness, peak Temp, undershoot during ramp and initial stabilization stapes.

Action items for next week:

1. Coral Test database: John will be digesting the above information. He will also be setting up access for functional area organizers to the Coral test database so interested people can test drive the data collection features.
2. Reporting wishlist: Organizers should be working with their groups to come up with a wishlist for reporting of Coral data collection.
3. When to qual: Organizers should also be working with their groups to come up with a general list of when and under which situations process quals need to be performed.

*Functional area groups and their members: labmembers volunteered to be the "organizers" (a role which may rotate among group members.)

• Litho Area: Aaron (organizer) J., Il Woong, Steve Z., Renata, Nahid, Maryam (Staff members: Mahnaz, Gary, Mario)
• Etch: Nahid (organizer), Tom, J., Il Woong, Renata, Maryam, Steve Z., Ray (Staff members: Nancy, Elmer, Mike)
• epi/epi2: Onur & Renata (organizers), Raja (Staff members: Maurice, Elmer)
• RTA: Raja (organizer), Tom, Serene (Staff members: Ed, Elmer)
• Furnaces: Maryam (organizer), J., Ray, Il Woong, Renata, Raja (Staff members: Nancy, Maurice, Ted, Ray)
• Metals: J. (organizer) (Staff members: Jeannie, Jim)

Action items from previous weeks:

• 1. Coral inputs: Each functional area team should map out its "process expectations" from this week's meeting into the framework outlined above. Try to be specific in the data fields to be collected, whether the field is required or forced, and any pull-downs, keeping in mind how users would use this. Done for 3 areas (need litho, furnaces, etch.)

  2. Coral outputs: Each functional area team should describe how they would like to be able to access and view the data.

• Process expectations: The organizer from each group should work with labmember volunteers to come up with criteria for process performance. This should include a specification of what a "standard process" is for a given tool and how the monitor is done (i.e., wafer prep, measurement method, reporting, etc.) It should be general enough to serve as a gage of equipment performance (i.e., test all critical functions, such as gas flows, pressure, temperature, whatever) but specific enough to be applicable to most users' needs. Done.
  
  
• Current trend data: Data is currently being done on a number of tools. Data will be provided to each of the volunteer groups (Mary) Done. (mostly)
  
  
• Equipment problem reports: Coral data for uptime and availability will be provided to each of the volunteer groups (Mary.) Done (PCS reports for one year provided.)

- ASML/SNF: ASML to provide specs on wafer curvature and handling. SNF to post on local server for users. (In progress -- and in parallel, ASML is collecting data from wafers in-house.)

- ASML/Mahnaz/Epi users: Test curved-wafer to handle-wafer method, where handle-wafer has a trimmed flat. (Not yet done.)

- ASML/Gary S: Gary can now retrieve wafers short of the e-chuck. (Partly done.)

- ASML/SNF: Build an alignment jig for device-wafer to handling-wafer mounting. (Not done).

- SNF: Stress gage. Paul R. will help anyone wishing to use the FSM. Investigating repair of the Flexus (Mary.) We will be acquiring a Flexus 2320 stress gage. ETA not yet determined.

- SNF: Find a way to monitor the plasma-off problem on stsetch1. (Elmer, Paul R.)

- stsetch users: Report plasma-off (and other) observations on Coral.

- Ed/Nahid: Assemble and share data from last year's REU/RET program. (Mostly done.)

- Ed/SNF: Jim McVittie did some contamination characterization experiments on stsetch1 some years ago. We need to obtain and examine these results. (Not done)

- Ed: Present stsetch2 RSM characterization results (at a future Grand Rounds?)

- Ed/J: Acquire and test cool grease. (Not done.)

- Ed/Mary: Contact other STS etch owners (at NNIN sites and elsewhere) and find out what they do for through wafer etching. (Not done)

- SpecMat:Work to resolve Nahid's request. (Not done)

- Nahid, Mario, Joey, w/input from SNF Staff: Develop an STS etch users survey to gage the user community's needs for DRIE. Survey should include questions about: substrate size requirements; substrates (SOI or not?); etch depth; minimum CD feature requirements (whether CD loss will be acceptable); contamination requirements/acceptable contamination levels; etc. (Mostly done.)