|
Equipment
Name
|
Use
|
Wafer
Size
|
Contamination
|
Comments
|
|
Step
Profile
|
Pieces
to 4 inch
|
No
|
||
|
Film
Thickness and Refractive Index
|
Pieces
to 6 inch
|
No
|
Single
or dual layer nonmetal films, >10A
|
|
|
Film
Thickness Measurement
|
Pieces
to 6 inch
|
No
|
Single
or dual layer transparent films, >300A
|
|
|
Nanospec2
|
Film
Thickness Measurement
|
Pieces
to 6 inch
|
No
|
Single
or dual layer transparent films, >300A
|
|
Sheet
Resistance Measurements
|
Pieces
to 6 inch
|
Probe
head for each group
|
||
|
Film
Stress Measurements
|
3
to 4 inch
|
No
|
|
|
|
Tencor P2
|
Step
Profile for Nonmetals and Standard Metal Wafers
|
Pieces
to 6 inch
|
Standard
Metals
|
1000A
to 65um
|
|
Tencor Alphastep
|
Step
Profile for Nonmetals and Standard Metal Wafers
|
Pieces
to 6 inch
|
Gold
|
500A
to 65um
|
|
Woollam Spectroscopic Ellipsometer
|
Film thickness and refractive index
|
Pieces to 6 inch
|
No
|
Multilayer transparent films, >10A
|
|
White
Light 3D Surface Profiler
|
Pieces
to 6 inch
|
No
|
|
Note:
Some of the above listed equipment may have materials
policies and/or restrictions that prohibit use of other equipment .
|
_______________________________________________________________
Stanford Nanofabrication Facility Last Modified 05/02/2008 |