EBEAM and OPTICAL PHOTORESISTS

Resist/Developer Spin Speed Thickness Application Resolution/thickness
SPR 3612/LDD26W 5000rpm/2000rpm Programs for 1um & 1.6um I AND G 0.6um w/1um
SPR 3617M/LDD26W   Programs for 1.2um & 1.6um Dyed version of SPR3612, for transparent substrates  

SPR220-7/LDD26W replacement for AZ4620

3500rpm/1000rpm Programs for 7um & 18um Micromachining  
SPR220-3/LDD26W   Thickness range 3 - 4 um    

AZ4620/MF319 limited access/phase out on 4620

Dev AZ400K limited access/phase out

4000rpm/1000rpm Std thickness 7 & 18um Micromachining  

AZ5214/MF322

5000rpm   Reversal  
LOL2000     Lift off under layer  
SPR 955CM//LDD26W Coming soon   canon2500 I line  
AZ Developer     Mask Making  
Microposit Concentrate     Mask Making  
EBEAM Resist/Dev*        
UVN2/CD26*     Neg  
UVN30/CD26*     Neg/like UVN2  
UV5/LDD26W*     Pos  
SNR200/CD14     Phase Out/same replaced by UVN2  
PMMA* 5%/MIBK:IPA 1:2 is std ratio, varies        
200 PMMA C5/same*        
950 PMMA M2/same*        
PMMA 200K/same*        
PMMA 950K 9%/same*        
PMMA 496K 9%/same*        
PMGI SF6/PMGI 101*        
PMGI 6% in cyclopertanon/PMGI 101*     Phase out  
ZEP 520*        
APEX-E/MF319*        
SAL601/MF322*        
Thinners Use      
Type P Thinner        
Primers Use      
MicroPrime HP 100% svgcoat vapor prime      
P-20 20% HMDS Spin on option      

 


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Stanford Nanofabrication Facility
Last Modified 09/08/2003