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Wet Processing
Procedures (with descriptions): Click <here>
General Chemical
Handling Policies: Click <here>
Etch rate Information:
Wet
Etch Rates of Selected SNF Films
Wet
Etch Rates of Films in Standard Etchants
Oxide Etch:
Non-metal
Wafers (wbnonmetal)
Wafers
with Standard Metals (wbmetal)
Non-standard
Materials (wbgeneral)
Use
of Triton X-100 (wbnonmetal, wbmetal & wbgeneral only)
Cleans:
Photoresist
Strip Procedures
Non-Standard
Metal Wafer Clean (wbgeneral only)
Standard
Prediffusion Clean Overview (procedures at specific wet benches: wbdiff,
wbgeneral,
wbsilicide)
Standard
Metal Clean Overview (wet bench-specific procedures: wbmetal,
wbgeneral)
Standard
Pre-LPCVD or Pre-Metal Clean Overview (wet-bench-specific procedures:
wbdiff, wbgeneral,
wbsilicide)
Tweezer
Clean Procedures
Other Non-Standard Processes (wbgeneral
only):
KOH
Etching of Silicon
Decontamination following KOH Etch
Non-standard
Nitride Strip
TMAH Etching of Silicon
Link
to Specific Wet Benches
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